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Therm Sil
耐高溫高導熱芯片封裝硅膠，替代現有封裝硅膠，高穩定，低維護，提供5-20倍更高導熱率，可使高結溫芯片性能和穩定性大幅提升，工作溫度可達125℃，導熱系數為0.6-2 W/mk。
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版權所有 ? 2021 江蘇科麥特科技發展有限公司 ?蘇ICP備17076076號，技術支持：迅響科技
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